Adhesives are widely used in the manufacture of electronic devices to act aspassive and active components. Recently there has been considerable interest in the use of conductive adhesives. This book reviews key types of conductive adhesives, processing methods, properties and the way they can be modelled as well as potential applications. INDICE: Introduction to adhesive joining technology for electronics. Part 1 Types of adhesive: Thermally conductive adhesives; Anisotropic conductive adhesives; Isotropic conductive adhesives; Underfill materials for flip-chip application. Part 2 Processing and properties: Microwave curing of electronic adhesives; Structural integrity of metal-polymer interfaces in microelectronics; The use of nanoscale additives to toughen epoxy adhesive systems; Modelling conductive adhesive properties; Adhesive technology for photonics.
- ISBN: 978-1-84569-576-7
- Editorial: Woodhead
- Encuadernacion: Cartoné
- Páginas: 280
- Fecha Publicación: 01/05/2011
- Nº Volúmenes: 1
- Idioma: Inglés