The topics include bonding-based fabrication methods of silicon-on-insulator,photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information. INDICE: Direct Bonding, Fusion Bonding, Anodic Bonding, Wafer Bonding: A Historical Patent Picture of the Worldwide Moving Front of the State-of-the-Artof Contact Bonding.- Basics of Silicon-on-Insulator (SOI) Technology.- Silicon-on-Insulator by the Smart CutTM Process.- ELTRAN® Technology Based on Wafer Bonding and Porous Silicon.- Wafer Bonding for High-Performance Logic Applications.- Application of Bonded Wafers to the Fabrication of Electronic Devices.-Compound Semiconductor Heterostructures by Smart CutTM: SiC-on-Insulator, QUASICTM Substrates, InP and GaAs Heterostructures on Silicon.- Three-DimensionalPhotonic Bandgap Crystals by Wafer Bonding Approach.- Wafer Direct Bonding for High-Brightness Light-Emitting Diodes and Vertical-Cavity Surface-Emitting Lasers.- High-Density Hybrid Integration of III--V Compound Optoelectronics with Silicon Integrated Circuits.- Layer Transfer by Bonding and Laser Lift-Off.-Single-Crystal Lithium Niobate Films by Crystal Ion Slicing.- Wafer Bonding of Ferroelectric Materials.- Debonding of Wafer-Bonded Interfaces for Handling and Transfer Applications.
- ISBN: 978-3-642-05915-5
- Editorial: Springer
- Encuadernacion: Rústica
- Fecha Publicación: 31/03/2012
- Nº Volúmenes: 1
- Idioma: Inglés