Focusing on materials technology for integrated circuit (IC) packaging, this comprehensive overview of semiconductor packaging materials also provides a working introduction to related subjects such as package form factors, interconnection technology, QA&R, and board assembly. It covers MEMS, solar, and LEDs, and considers the interaction of package materials on device performance and assembly technology. Accessible to newcomers as well as professionals, this book discusses the reliability tests and analytical tools necessary and touches on future trends in semiconductor packaging technology.
- ISBN: 978-1-4398-6205-6
- Editorial: CRC Press
- Encuadernacion: Cartoné
- Páginas: 215
- Fecha Publicación: 19/09/2011
- Nº Volúmenes: 1
- Idioma: Inglés