New Materials and Devices for 5G Applications and Beyond focuses on the materials, device architectures and enabling integration schemes for 5G applications and emerging technologies. It gives a comprehensive overview of the trade-offs, challenges and unique properties of novel upcoming technologies. Starting from the application side and its requirements, the book examines different technologies under consideration for the different functions, both more conventional to exploratory, and within this context the book provides guidance to the reader on how to possibly optimize the system for a particular application. This book aims at guiding the reader through the technologies required to enable 5G applications, with the main focus on mm-wave frequencies, up to THz. New Materials and Devises for 5G Applications and Beyond is suitable for industrial researchers and development engineers, and researchers in materials science, device engineering and circuit design. Reviews the challenges and emerging opportunities for materials, devices, and integration to enable 5G technologies Includes discussion of technologies such as RF-MEMs, RF FINFETs, and transistors based on current and emerging materials (InP, GaN, etc) Focuses on mm-wave frequencies up to the terahertz regime INDICE: 1. Introduction: 5G and what does it mean? How it is different from 4G-LTE, challenges and opportunities2. Different applications: from user equipment to small cells to base-station and what are the requirements3. Overview of different technologies for RF-FEM and transceiver; introduce the radio-chip, what technologies are used now for the different components of the radio chip and what are the trends4. RF FinFET technologies and beyond: how do they compare to CMOS, ways to reduce parasitics and improvement path5. FDSOI and RF-SOI technologies6. SiGe HBT and BiCMOS7. RF GaN: a basestation technology only or also for UE? GaN-on-Si vs GaN-on-sapphire and GaN-SiC 8. Thin film materials for switches: 2D materials vs. RF-SOI/MEMS9. Filter technologies & materials10. The need for heterogeneous integration incl. 3D technologies11. Beyond 5G, the need for ever higher data-rates12. InP-based technologies: HEMT vs HBT13. RF packaging
- ISBN: 978-0-12-822823-4
- Editorial: Elsevier
- Encuadernacion: Rústica
- Páginas: 275
- Fecha Publicación: 01/04/2024
- Nº Volúmenes: 1
- Idioma: Inglés