Wire bonding in microelectronics

Wire bonding in microelectronics

Harman, George

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The classic sourcebook for designing and evaluating wire bonds engineered with the latest metallurgies - completely updated. Wire bonding is the attachmentof fine wires from semiconductor chips to their substrates - a connection that is vital to the success of ever-shrinking consumer electronic devices, such as iPODs. Long-established as the industry standard, this book has been completely revised and expanded to cover wire bonding advances for the era of super-small electronics. "Wire Bonding in Microelectronics", Third Edition, equips you with everything needed to design and evaluate wire bonds engineered with cutting-edge metallurgies. The Second Edition provides full details and step-by-step instructions for engineering reliable bonds at a very high yield. The author presents up-to-the-minute information on utilizing fine-pitch wire bonds, low-looping bonds, wafer-level bumping, and more. INDICE: Introduction to Third Edition; Acknowledgments; Introduction to CD; Chapter 1. The Technical Introduction to the Third Edition; Chapter 2. Ultrasonic Bonding Systems and Technologies, Including a Description of the Ultrasonic Wire Bonding Mechanism; Chapter 3. Bonding Wire Metallurgy and Characteristics That Can Affect Bonding, Reliability, or Testing; Chapter 4. Wire Bond Testing; Chapter 5. Gold-Aluminum Intermetallic Compounds and Other Metallic Interface Reactions in Wire Bonding; Chapter 6. Introduction to Plating, Section A (Gold) and Section B (Nickel-Based) Bond Pad Technology and Reliability; Chapter 7. Cleaning to Improve Bondability and Reliability; Chapter 8. MechanicalProblems in Wire Bonding; Chapter 9. Advanced and Specialized Wire Bonding Technologies; Chapter 10. An Overview of the Materials and Material Science of Copper, Low-k Devices that Affect Bonding and Packaging; Chapter 11. Wire Bonding Process Modeling and Simulation; Glossary; Bibliography; Index

  • ISBN: 978-0-07-147623-2
  • Editorial: McGraw-Hill
  • Encuadernacion: Cartoné
  • Páginas: 432
  • Fecha Publicación: 01/03/2010
  • Nº Volúmenes: 1
  • Idioma: Inglés