BSIM-Bulk Mosfet Model for Wireless and Mixed-Mode ICS

BSIM-Bulk Mosfet Model for Wireless and Mixed-Mode ICS

Hu, Chenming
Agarwal, Harshit
Gupta, Chetan
Chauhan, Yogesh Singh

202,80 €(IVA inc.)

BSIM-Bulk Mosfet Model for Wireless and Mixed-Mode ICS provides in-depth knowledge of the internal operation of the model. The authors not only discuss the fundamental core of the model, but also provide details of the recent developments and new real-device effect models. In addition, the book covers the parameter extraction procedures, addressing geometrical scaling, temperatures, and more. There is also a dedicated chapter on extensive quality testing procedures and experimental results. This book discusses every aspect of the model in detail, and hence will be of significant use for the industry and academia. Those working in the semiconductor industry often run into a variety of problems like model non-convergence or non-physical simulation results. This is largely due to a limited understanding of the internal operations of the model as literature and technical manuals are insufficient. This also creates huge difficulty in developing their own IP models. Similarly, circuit designers and researcher across the globe need to know new features available to them so that the circuits can be more efficiently designed. Reviews the latest advances in fabrication methods for metal chalcogenide-based biosensors Discusses the parameters of biosensor devices to aid in materials selection Provides readers with a look at the chemical and physical properties of reactive metals, noble metals, transition metals chalcogenides and their connection to biosensor device performance INDICE: 1. Background2. BSIM-BULK Core Model3. Real Device Effects4. Leakage current and thermal effects 5. BSIM-BULK Charge and Capacitance Model6. Noise and RF Modeling 7. Junction Diode and Layout Dependent Parasitic Model 8. Compact Modeling of High Voltage Devices 9. Parameter Extraction 10. BSIM-BULK Model Quality Testing

  • ISBN: 978-0-323-85677-5
  • Editorial: Woodhead Publishing
  • Encuadernacion: Rústica
  • Páginas: 325
  • Fecha Publicación: 01/03/2023
  • Nº Volúmenes: 1
  • Idioma: Inglés