Advanced Thermal Management Materials provides a comprehensive and hands-on treatise on the importance of thermal packaging in high performance systems. These systems, ranging from active electronically-scanned radar arrays to web servers, require components that can dissipate heat efficiently. This requires materials capable of dissipating heat and maintaining compatibility with the packaging and dye. Coverage includes all aspects of thermal management materials, both traditional and non-traditional,with an emphasis on metal based materials. An in-depth discussion of properties and manufacturing processes, and current applications are provided. Also presented are a discussion of the importance of cost, performance and reliability issues when making implementation decisions, product life cycle developments, lessons learned and future directions. INDICE: Introduction to Microelectronics Packaging Thermal Management.- Requirements of Thermal Management Materials.- Traditional Thermal Management Packaging Materials.- Manufacturing Processes of Traditional Packaging Materials.- Development of Advanced Thermal Management Materials.- Copper Based ThermalManagement Materials.- Aluminum Based Thermal Management Materials.- Cost andPerformance Considerations.- System and Component Integration of Advanced Packaging Materials.- Typical Development Plan for Introduction of Advanced Materials in Products.- Future Trends.
- ISBN: 978-1-4614-1962-4
- Editorial: Springer
- Encuadernacion: Cartoné
- Fecha Publicación: 28/06/2012
- Nº Volúmenes: 1
- Idioma: Inglés