Introduction to microsystem packaging technology

Vastly ahead of the field, this resource illustrates developments in microsystem packaging (MSP) design and manufacture, including advanced substrate and interconnection technology. It also details 3D-package and system-level packagedevelopment with a decidedly MEMS perspective. Integrating the work of international engineers, this book presents a diversity of technologies in relation to MSP. The ultimate reference on this sophisticated level of package design and techniques, it covers encapsulation and sealing and system-in-package, as well as device-level and optoelectronics packaging. It also includes coverage of modular assembly, inspection, and reliability design, with a number of real-world case studies.

• ISBN: 978-1-4398-1910-4
• Editorial: CRC Press
• Encuadernacion: Cartoné
• Páginas: 232
• Fecha Publicación: 08/06/2010
• Nº Volúmenes: 1
• Idioma: Inglés