Electromigration in thin films and electronic devices: materials and reliability

Understanding and limiting electromigration in thin films is essential to thecontinued development of advanced copper interconnects for integrated circuits. Electromigration in thin films and electronic devices provides an up-to-date review of key topics in this commercially important area. Part 1 consists ofthree introductory chapters, covering modelling of electromigration phenomena, modelling electromigration using the peridynamics approach and simulation and x-ray microbeam studies of electromigration. Part 2 deals with electromigration issues in copper interconnects, including x-ray microbeam analysis, voiding, microstructural evolution and electromigration failure. Finally, part 3 covers electromigration in solder, with chapters discussing topics such as electromigration-induced microstructural evolution and electromigration in flip-chipsolder joints. With its distinguished editor and international team of contributors, Electromigration in thin films and electronic devices is an essential reference for materials scientists and engineers in the microelectronics, packaging and interconnects industries, as well as all those with an academic research interest in the field. INDICE: Part 1 Introduction: Modelling of electromigration phenomena; Modeling electro¬migration using the peridynamics approach; Modeling, simulation, and x-ray micro¬beam studies of electromigration. Part 2 Electromigration in copper interconnects: X-ray microbeam analysis of electromigration in copper interconnects; Voiding in copper interconnects during electromigration; The evolution of microstructure in copper interconnects during electromigration; Scaling effects on electromigration reliability of copper interconnects; Electromigration failure in nanoscale copper interconnects. Part 3 Electromigration in solder and Wirebonds: Electromigration-induced microstructural evolution in lead-free and Pb-Sn solders; Electromigration in flip-chip solder joints.

• ISBN: 978-1-84569-937-6
• Editorial: Woodhead
• Encuadernacion: Cartoné
• Páginas: 352
• Fecha Publicación: 01/09/2011
• Nº Volúmenes: 1
• Idioma: Inglés