RF and microwave microelectronics packaging

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and toacademic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields. INDICE: Fundamentals of packaging at microwave and millimeter-wave frequencies.- Low-Cost High-Bandwidth Millimeter Wave Leadframe Packages.- Polymeric Microelectromechanical Millimeter Wave Systems.- Millimeter-Wave Chip-on-BoardIntegration and Packaging.- Liquid Crystal Polymer for RF and Millimeter-WaveMulti-Layer Hermetic Packages and Modules.- RF/Microwave Substrate Packaging Roadmap for Portable Devices.- Ceramic systems in package for RF and microwave.- Low-Temperature Cofired-Ceramic Laminate Waveguides for mmWave Applications.- LTCC Substrates For RF/MW Application.- High Thermal Dissipation Ceramics and Composite Materials for Microelectronic Packaging.- High Performance Microelectronics Packaging Heat Sink Materials.- Technology Research on AlN 3D MCM.

• ISBN: 978-1-4419-0983-1
• Editorial: Springer
• Encuadernacion: Cartoné
• Páginas: 300
• Fecha Publicación: 01/12/2009
• Nº Volúmenes: 1
• Idioma: Inglés