Solder joint reliability prediction for multiple environments

Solder Joint Reliability of Electronic Packages will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense and automotive industries. Provides a comprehensive summary of current literature on lead-containing ceramic area array electronic package solder joining reliability Develops useful and easy-to-use tools for predicting solder joint fatigue life under thermal cycling and power cycling environments. Offers insight into how to relate accelerated thermal cycling testing conditions to real world applications INDICE: Introduction.- Literature review of ceramic area array solder joint reliability.- Background information on solder joint reliability.- Finite element modeling for solder joint reliability under multiple environments.- Predictive fatigue life under thermal cycling and power cycling.- Predictive fatigue life under vibration environments.- Universal predictive fatigue life equation and study of the effect of design parameters.- Acceleration factor to relate thermal cycles to power cycles.- Investigation of solder joint fatigue lifeunder sequential environments.- Conclusions.

• ISBN: 978-0-387-79393-1
• Editorial: Springer
• Encuadernacion: Cartoné
• Páginas: 250
• Fecha Publicación: 01/09/2008
• Nº Volúmenes: 1
• Idioma: Inglés