Written by an author and editor team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable,first-hand information on bonding technologies. To begin with, a thorough introductory section acquaints readers with the fundamentals of wafer bonding andthe challenges facing this key technology. In the second part, researchers from companies and institutions around the world discuss the most reliable and reproducible technologies for the production of bonded wafers. The third and final part is devoted to current and emerging applications, including microresonators, biosensors and precise measuring devices. INDICE: Preface INTRODUCTION Historical background: From BSOI Wafers to 3DICs, From Glass Wafer Bonding to Hermetic Metal Seals Classification of WaferBonding Techniques: Intermediate Layers, Temperature, Technology Headline Wafer Bonding Fundamentals: Bonding Theory, Bonding Conditions, Testing Techniques Challenges for Wafer-to-Wafer and Chip-to-Wafer Bonding TECHNOLOGIES Adhesive Bonding: Glass Frit Bonding, Spin on Glass, Polymers Anodic Bonding: Double stacks, Triple Stacks, Thin Film Anodic Bonding Direct Wafer Bonding: Fusion Bonding, Plasma-activated Bonding, Surface-activated Bonding Metal Bonding: Eutectic Bonding, Thermo-compression. Thermo-sonic Bonding, SLID Bonding, Ni-Au ?-Inserts, Nano Lawn Hybrid Metal/Dielectric Bonding: Cu/BCB, CuSiO2, Ni/SiO2 APPLICATIONS MEMS: Non-hermetic, Hermetic, Extremely Hermetic, Combined Possibilities BESOI/BSOI Wafer Fabrication MIMOS for Integrated Sensors, Vacuum Applications 3D Integration Handling of Thin Wafers/Dies, Temporary Bonding: Adhesive, Electrostatic
- ISBN: 978-3-527-32646-4
- Editorial: Wiley-VCH
- Encuadernacion: Cartoné
- Páginas: 432
- Fecha Publicación: 11/01/2012
- Nº Volúmenes: 1
- Idioma: Inglés