Advanced nanoscale ULSI interconnects: fundamentals and applications

This book presents one of the new frontiers of modern electrochemistry science and technology: electrochemical processes for Ultra-large-Scale Integration (ULSI) technology for Integrated Circuits (ICs) applications. This is a field which influences our day to day life and still presents major technological and scientific challenges. This book reviews ULSI technology in light of all thenovel electrochemical processes which make ULSI technology possible. The bookwill focus on sub-100 nm CMOS technology, mainly on copper-based metallization. The multidisciplinarity of this book makes it an especially valuabe tool for those interested in ULSI Interconnects INDICE: Introduction.- Technology Background.- Interconnect Materials.- Deposition Processes for ULSI Interconnects.- Modeling.- Electrochemical ProcessIntegration.- Electrochemical Processes and Tools.- Metrology.- Summary and Foresight.

• ISBN: 978-0-387-95867-5
• Editorial: Springer
• Encuadernacion: Cartoné
• Páginas: 365
• Fecha Publicación: 01/09/2009
• Nº Volúmenes: 1
• Idioma: Inglés