3D integration for noc-based SoC architectures

This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domainby renowned experts in the field to build a comprehensive and consistent bookaround the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field. Provides a detailed background on the state of error control methods for on-chip interconnects, including Error Control Coding, Double Sampling, and On-Line Testing Describes the use of more complex concatenated codes such as Hamming Product Codes with Type-II HARQ, while emphasizing integration techniques for on-chip interconnect links Presents techniques for managingintermittent and permanent errors using a non-interrupting in-line test method with spare wire replacement INDICE: Three-Dimensional Integration of Integrated Circuits - an Introduction.- The Promises and Limitation of 3-D Integration.- Testing 3D Stacked ICsContaining Through-Silicon Vias.- Design and Computer Aided Design of 3DIC.- Physical Analysis of NoC Topologies for 3-D Integrated Systems.- Three-Dimensional Networks-on-Chip: Performance Evaluation.- Asynchronous 3D-NoCs.- Design of Application-Specific 3D Networks-on-Chip Architectures.- 3D Network on ChipTopology Synthesis: Designing Custom Topologies for Chip Stacks.- 3-D NoC on Inductive Wireless Interconnect.- Influence of Stacked 3D Memory/Cache architectures on GPUs.

• ISBN: 978-1-4419-7617-8
• Editorial: Springer
• Encuadernacion: Cartoné
• Páginas: 290
• Fecha Publicación: 29/11/2010
• Nº Volúmenes: 1
• Idioma: Inglés