This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry. Focuses on the foundry-based process technology for the fabrication of 3-D ICs Discusses the technology platform for pre-packaging wafer level 3-D ICs Includeschapters contributed by various experts in the field of wafer-level 3-D ICs process technology INDICE: Part I: Introduction and Background.- Overview of Wafer Level 3-D Ics.- Part II: Sequential Approaches.- Laser Annealing/Graphoepitaxy.- Seeding.- Epitaxial Overgrowth.- Part III: Assembly Approaches.- Technology Platform Considerations.- Metallic Bonding.- Dielectric Bonding.- Hybrid Bonding.- PartIV: Applications.- Applications of 3-D ICs.- Part V: Challenges and Outlook.-Reliability.- Status and Outlook.
- ISBN: 978-0-387-76532-7
- Editorial: Springer
- Encuadernacion: Cartoné
- Páginas: 300
- Fecha Publicación: 01/06/2008
- Nº Volúmenes: 1
- Idioma: Inglés